With the integration of RF, Analog, and Digital components on the same substrate, there are many new design challenges facing the IC designers. These includes design of low-noise circuits, minimization of noise coupling from Digital to RF and mixed-Signal, design issues related to baseband coupling to RF, and many other design challenges. The mixed-signal circuits in a wireless transceiver is a bridge between the RF circuits and the baseband digital signal processing. As such they tend to overlap two disciplines and can often be the weak link in a system definition. The set of talks in this tutorial will cover the design of mixed-signal IC for the receiver, transmitter, and auxiliary functions required in a wireless transceiver . Consideration will be given to the system requirements, technology requirements, and testing.
Noise is a severe limitation and a significant challenge in achieving the System-on-a-chip total integration (analog, RF, digital, and memory, all on the same chip), and generally for any mixed-signal circuit. Technology, circuit, and physical design aspects related to
the substrate noise problem in mixed-signal circuits are discussed in this presentation. brief extension is made to the substrate noise problem in low-voltage circuits.
Time: 8-12 AM; Each Presentation is 45 minutes.
The list of speakers in this tutorial will include:
- 8-8:45 -- Low-power mixed-signal design for wireless communications; Carlos Leme; Dr. Jose Franca; Chip-Idea; Lisbon, Portugal.
- 8:45-9:30 -- The Design Of Mixed-Signal Interface Circuits for Cellular Systems; Malcolm Smith; Intel Inc.
- 9:30-10:15 -- Noise and Substrate Coupling in Communication Mixed-Signal IC's; Radu Secareanu, Motorola Inc., Advance Circuits Research Group
- 10:15-10:30 Break
- 10:30-11:15 -- RF Multi-standard systems, Yann Deval; Bordeaux University, France
- 11:15-12:00 Analog HDL Modeling for Communication Applications; Marco Oliveira and Nuno Franca; Chip-Idea; Lisbon, Portugal.